A ball grid array, or BGA, is a type of packaging used to mount a device like a microprocessor. They are used for integrated circuits. BGAs allow for the entire bottom surface of the device to be used rather than just the perimeter, while the leads are shorter on average which creates better high-speed performance. BGAs are made of many, many layers overlapping one another and can contain anywhere from one to one million of a variety of circuits, including but not limited to logic gates, multiplexers, flip-flops, etc. In general, ball grid arrays (sometimes mistakenly referred to as "bonded grid arrays") have high lead count, a remarkable effective density, and minimal inductance.
The BGA is derived from the PGA or pin grid array, which has a face covered or partially covered by pins which use a grid pattern. BGA packages can have an advantage over other packages due to a lower thermal resistance. Heat that is generated by the circuit flows more easily to the PCB or printed circuit board, which keeps the chip from overheating.
BGA heat sinks are available in multiple sizes for thermal management for low power applications. Like all heat sinks, BGA heat sinks can be customized and designed to your specifications according to your needs. Though some believe BGA stands for "bonded grid arrays," your custom ball grid arrays are sure to address whatever thermal management concerns your particular electronic device presents. Be sure that whatever company you decide on for your thermal management needs considers bga heat sinks for your application.
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The BGA is derived from the PGA or pin grid array, which has a face covered or partially covered by pins which use a grid pattern. BGA packages can have an advantage over other packages due to a lower thermal resistance. Heat that is generated by the circuit flows more easily to the PCB or printed circuit board, which keeps the chip from overheating.
BGA heat sinks are available in multiple sizes for thermal management for low power applications. Like all heat sinks, BGA heat sinks can be customized and designed to your specifications according to your needs. Though some believe BGA stands for "bonded grid arrays," your custom ball grid arrays are sure to address whatever thermal management concerns your particular electronic device presents. Be sure that whatever company you decide on for your thermal management needs considers bga heat sinks for your application.
For further more about information : bonded grid arrays Please Visit to website