What are Bonded Grid Arrays/BGA Heat Sinks?

Navigating through the world of electronics is an exciting adventure, but there are so many small details to keep in mind. The wide variety of heat sinks can be difficult to figure out at first, but with enough patience you’ll be an expert before you know it.

First to understand what a BGA Heat Sink is, you need to know exactly what a heat sink does. As the world of microelectronic devices increases in heat dissipation while simultaneously reducing in size, trying to manage the heat in electronics is increasingly becoming a very important element of creating any electronic product.
If a product produces too much heat it shortens the life expectancy and reliability of the device. Through experiments it been shown there is a direct relationship between the operating temperature of a device, and how long it lasts. In order to ensure that a device gives the brand a good name managing temperature is a huge factor.

This is where heat sink comes in. Heat sinks are the devices that dissipate heat from a electronic devices. Once the object is hot, the heat sink works to lower the temperature to cooler, ambient temperature. A heat sink does this by increasing the surface area directly in contact with the coolant of the product allowing more heat to dissipate.

BGA heat sinks, or bonded grid arrays, is one variety of heat sink devices. Due to its major cooling capacity, it works with some of the most demanding applications. If you want to find out what BGA is right for your device, it is wise to consult with a professional to find out more since there is such a wide variety of these devices.

For further details about bonded grid arrays and bga heat sinks please visit the website.

A Battle of the Heat Sinks: Skived Fin Vs. Folded Fin

There are a wide variety of copper heat sinks all with different applications, pros, and cons. We wanted to create a brief resource for those trying to compare these heat sinks. Before we got started, we wanted to recommend if you want to learn even more about copper heat sinks to contact professionals.

Pros and Cons of Folded Fins

This type of copper heat sink was originally developed to be used on airplanes and satellites. The folded fins are made by folding a strip of copper repeatedly in a wave pattern. On each there is thermal conductive epoxy attached onto the copper.

Advantages of Folded Fins

• Lightest of all heat sinks
• Can have the finest fin
• Minimize the amount of space need to mount
• Dissipates the most heat per surface area

Cons of Folded Fins

• More costly than skivs
• Sometimes nickel plated required for soldering
• Require joints which reduce thermal conductivity

Pros and Cons of Skived Fins

Skived fins evolved from folded fins, and they offer higher fin density with improved thermal conductivity when compared to folded fins. These heat sinks are carved from the base of the heat sink with a very thin blade which is folded and then aligned.

Advantages of Skived Fins

• Ideal thermal conductivity with base
• Inexpensive prototyping
• Thin fins
• Can be made from copper or aluminum

Disadvantages of Skived Fins

• Fin and base have to be same material
• Fins have to be parallel
• Sometimes extra machining step is needed if the base is 3.0 mm or less


Conclusion on Copper Heat Sinks

As you can see, each type of fin has unique features and applications to consider. To learn more about a variety of copper heat sinks visit this website.

For further details about copper heatsinks and heat sinks please visit the website.