Bonded grid arrays are heat sink assemblies that are highly
efficient, cost effective, reliable thermal management solutions for
density packed or high-power packaged applications. These
characteristics hold true in demanding vibration and shock environments.
Bonded grid arrays are used when simple extrusions are impractical.
They lower thermal resistance and increase surface area. There are
various configurations that can be assembled.
Any industry,
employing high-powered electronic circuits can use bonded grid arrays. A
partial list of industries includes factory automation, medical
equipment, wireless and RF, military, broadcast, telecommunications, and
renewable energy. When choosing bonded grid arrays consider the overall
dimensions, specified thermal resistance, and the finish. Finishes
include gold iridite, clear iridite, gold chromate, or unfinished.
Finding
the device that is appropriate for a cooling system to be effective is
important to the overall design of a component. BGA heat sinks are
available in ceramic and plastic. A major benefit of BGA heat sinks is
the increased heat dissipation rate.
The ball grid design is
achieved by advance circuitry that allows quick thermal energy
conveyance without the levels of resistance, prone to occur with the
surface mounting approach of the gull wing. Gull wing leads cannot reach
the heatsink pin count capacity of BGA heat sinks.
The most
innovative BGA heat sinks aspect is the ability to self-align based on
the heat flow from its source. This characteristic has the potential to
allow greater thermal energy transfer levels and increase efficiency
throughout the heatsink.
There are some drawbacks to consider
before making a final decision. Because of the joint solder complexity,
standard reworking and inspection methods cannot be achieved. Solder
joints cannot be individually adjusted and basic visual inspection is
not possible. A proposed solution to this problem is x-ray use to ensure
reliable BGA heat sinks.
