The Thought Process Behind Cooling Source BGA Heat Sinks

The aim of designing heatsinks is twofold. The heatsinks need to provide thermal conduction inside and thermal convection on the surface. Evolutionary methods have optimized heatsinks for specific tasks that make efficient use of material and energy.

Nature is a source of inspiration when developing new products. Think about the branched systems of leaf venation and human blood circulation. Both systems take in and transport matter while conserving materials and structural stability. Designs vary based on effects in the environment.

Many successful heat sink designs are based on the same principle. They transport and dissipate heat energy. The result is an efficient solution for the required task. Shapes and processes are in harmonic balance. The technical function of heat dissipation connects intrinsic design of the device for which it is used.

Cooling Source offers a wide selection of BGA heat sinks. Our specialty is providing mechanical attach solutions where heatsinks are connected to the chip without holes or adhesives in the printed circuit board (PCB). The attachment solutions are used for high-reliability applications.

Customers choose Cooling Source when they need reliable, cost-effective cooling solutions. Our BGA heatsinks are made from high-conductivity aluminum. They handle the most demanding applications. We have a variety of attachment options, shapes, and sizes from which to choose.

If a standard option does not meet the customer's needs, we have a custom design service that will. Some of the BGA heat sinks we carry include:

 Elliptical Fin BGA Heat Sinks

 Pin Fin BGA Heat Sinks

Straight Fin BGA Heat Sinks

 Elliptical Fin Heatsinks

Elliptical fin heatsinks are aluminum BGA heat sinks that are highly efficient cooling devices ideal for environments with linear airflow. They are an improvement on cross cut heatsinks that were simply plated fin heatsinks with extra cuts across the fin length. The aerodynamic fins of the elliptical shape make airflow efficiency easier. They are ideal when airflow is limited.

Pin Fin Heatsinks

Cooling Source offers pin fin heatsinks that are well-suited for applications where airflow comes from the top. Precision forged pin fin heatsinks come in passive and active versions. The pin fin heatsinks can be forged of copper or aluminum.

Straight Fin Heatsinks

These heatsinks have many base dimensions and heights up to 15 mm They are ultra-performance heatsinks that have a high aspect ratio. The design of the straight fin heatsinks is optimal for applications with adequate airflow. They offer excellent cooling solutions for PCB layouts that are spatially constrained.

The high-performance ensures a reliable life of the product at a cost lower than other extruded heatsinks. The extruded aluminum keeps costs down, reduces weight, and minimizes thermal resistance. Cooling Source has or makes all of these heatsinks and more. Call us at 925-292-1293.

TO know more about bga heat sinks please visit our website.

Creating Larger Aluminum Heat Sink Extrusions

With continued advancement in consumer electronics and rapid growing LED lighting options, new products require increased energy demands with a smaller footprint. Increased power can cause heat that is detrimental to electronics.

Dealing with that heat presents a thermal management challenge. The most common technology for electronic modules is extruded aluminum heatsinks. There are two categories of extruded aluminum heatsinks – high ratio and low fin.

The fin ratio compares the fin height to the width between the fins. Typically, extruded aluminum heatsinks have a ratio of 6:1. That ratio does not meet most power electronics requirements. The typical ratio needed ranges from 12:1 to 19:1.

A greater fin ratio indicates greater surface area. Greater surface areas mean larger amounts of heat can be removed. Specific technology and experience are required for heat sink extrusions with higher ratios. It's hard to find heat sink extrusions that are more than 24 inches wide.

Heat sink extrusions are thermal devices made of a solid piece of aluminum. Insulators are eliminated and make the heat sink extrusions more thermally efficient. Most heat sink extrusion applications use natural convection, eliminating the need for fans.

Bonded fin heat sinks that have a higher aspect ratio are common means to overcome the heat sink extrusion ratio limitations when higher ratios are required. Friction stir welding (FSW) offers a different approach.

It is eight percent more efficient and has more options. Combining FSW and the extrusion process, heat sink ratios that exceed 40:1 are possible. The combination allows for

Maximum flexibility regarding fin geometry and ratio

 The heat sink extrusions footprint

 Production of large scale heatsinks

 The custom extruded aluminum heatsinks replace bonded fin heatsink coil aspects. FSW is also used for liquid cold plates to seal them efficiently while allowing other features to be added to base plates at a lower cost.

TO know more about heat sink extrusions please visit our website.