Introduction to Heatpipes

Heat pipes are devices used for heat transfer that combine two principles: phase transition and thermal conductivity. These principles are combined in order to manage the transfer of heat that takes place between two solid interfaces. Where a liquid comes in contact with the hot heatpipe, this liquid turns into a vapor, which travels along the heat pipe until it reaches the cold interface where it condenses back into a liquid; this relseases the latent heat. The process repeats when the liquid then returns to the hot interface of the heatpipe again via capillary action or centrifugal force or gravity.

Heatpipes are very effective thermal conductors, though the specific thermal conductivity varies from heat pipe to heatpipe according to the length. Heat pipes typically are composed of a sealed pipe made of a material appropriate for the fluid that is being used. For example, copper is typical for water heatpipes, while aluminum is usually used for ammonia heat pipes. A vacuum pump is used to remove air from the empty heatpipe before a working fluid partially fills the heat pipe prior to sealing. Within the temperature range of the operating heat pipe, the heatpipe should contain both liquid and vapor.

Heatpipes date back to the advent of steam technology during the steam age, along with the “Perkins Tube” which was used widely in working ovens and train boilers. The term “heatpipe” wasn’t coined until 1963, when George Grover independently developed the technology at Los Alamos National Laboratory.

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Ball Grid Arrays and BGA Heat Sinks

A ball grid array, or BGA, is a type of packaging used to mount a device like a microprocessor. They are used for integrated circuits. BGAs allow for the entire bottom surface of the device to be used rather than just the perimeter, while the leads are shorter on average which creates better high-speed performance. BGAs are made of many, many layers overlapping one another and can contain anywhere from one to one million of a variety of circuits, including but not limited to logic gates, multiplexers, flip-flops, etc. In general, ball grid arrays (sometimes mistakenly referred to as "bonded grid arrays") have high lead count, a remarkable effective density, and minimal inductance.

The BGA is derived from the PGA or pin grid array, which has a face covered or partially covered by pins which use a grid pattern. BGA packages can have an advantage over other packages due to a lower thermal resistance. Heat that is generated by the circuit flows more easily to the PCB or printed circuit board, which keeps the chip from overheating.

BGA heat sinks are available in multiple sizes for thermal management for low power applications. Like all heat sinks, BGA heat sinks can be customized and designed to your specifications according to your needs. Though some believe BGA stands for "bonded grid arrays," your custom ball grid arrays are sure to address whatever thermal management concerns your particular electronic device presents. Be sure that whatever company you decide on for your thermal management needs considers bga heat sinks for your application.

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LED Lights and Heatsinks

Have you ever been curious why LED lights aren’t as hot as other types of lights? Given the popularity of LED lights these days, especially as many of us put up Christmas lights prior to the upcoming holiday, it is quite fascinating to consider the way in which LED lights deal with the issue of heat dissipation and management as compared to other types of lights.

The variation in heat produced by different types of lights is quite drastic. As measured by one online retailer, a halogen bulb operated at 327 degrees. A CFL was cooler at only 167 degrees, but the LED was coolest by far at only 107 degrees. Heatsinks keep LEDs cooler than the competition, allowing for my toddler to handle the lights on our Christmas tree without me worrying that he’s going to burn his hands (and taking away the worry that the tree may catch on fire!).

Heatsinks in general work to dissipate heat for any kind of electronic and not just lights. LEDs, however, are a perfect example to provide which most of us are familiar with, as everyone knows how hot an incandescent light bulb can get. Heatsinks can be designed in a nearly infinite array with variations provided to meet the different needs of the application. LED heatsinks, like all heatsinks, can be made from different materials with different structures meant to maximize surface area to release heat more efficiently. Many heatsinks utilize pins, fins and other components for the general purpose of thermal management.

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Copper Heat Pipes

Copper heat pipes are made from copper and use water as the working fluid. These pipes typically operate between 20 to 150 degrees C. Such pipes can be manufactured in different “geometries” or shapes, such as tubular heat pipes and planar heat pipes. Diameters vary but typically fall between 1/16” and 1.5 mm and 1.5” or 38 mm, though custom diameters are possible based on a customer’s specific needs. Planar pipes can be used as heat spreaders.

Copper heat pipes can be combined with other components creating heat transfer assemblies. Some examples of such applications include: heat pipe sinks which are used for both energy conversion device cooling and electronics; embedded heat pipe heat spreaders, which cool electronics; and heat pipe heat exchangers, which cool electronics enclosures among other possibilities.

Regardless of your specific application for heat pipes or copper heat pipes in particular, the various types of heat pipe assemblies can be manufactured to your specifications to ensure the best results. As mentioned earlier, the diameter, cross section geometry, and length are all customizable. So are the length geometry (allowing for straight or multiple bends), bonding of heat piper to assembly (mechanical, epoxy or soldering), and surface coating (often nickel or tin). Contact your local company that specializes in copper heat pipes to get started on your project today. The company should be able to give you an idea of how long the project will take to complete as well as the total costs involved given your specifications.

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Extruded Aluminum Heatsinks

Extruded aluminum heatsinks, or aluminum heat sink extrusions, are a very common component used for heat management in electronics. Heatsinks in general are critical for cooling the systems of such products and provide huge benefits for commercial and electronic device manufacturers. Extruded shapes are typically more tolerant than machined parts, in addition to often being more cost effective.

Aluminum has a number of qualities that make it an excellent choice for meeting your heatsink needs. Aluminum alloys are typically very malleable when compared to other metals and can be used to create a wide variety of different heat sink designs. Aluminum is also lightweight but strong. Aluminum is both a good hear reflector and a good heat conductor, which makes it very useful as a reflective heat shield and for heat transfer applications.

Aluminum is thermally less conductive than some other metals, but the alternatives, like copper, are more difficult to work with. Aluminum is also easier to work with when creating custom aluminum heatsinks, perhaps with foil, fins, or sheets.

Extruded aluminum heatsinks and heat sink extrusions in general are often easier to make, allowing for faster turn-around time and lower total cost. When looking for a manufacturer for your heatsink needs, discuss price and well as the amount of time it will take to complete the project. Make sure you find an experienced manufacturer who can meet your specifications. If possible, ask for referrals and talk to other individuals who have utilized this company’s services.

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Different Challenges Addressed by Custom Heatsinks

Given the extraordinary prevalence of electronics in nearly every aspect of our daily lives these days, it’s no wonder the demand for custom heatsinks is so high. If you find yourself with a particularly difficult or unusual application for a custom heatsink, the following examples may be helpful to you when discussing your needs with a custom heatsink manufacturer.

If your electronic components are in need of cooling via natural convention rather than forced air cooling, this particular application is inherently more challenging. Without the air flow often provided by a fan, the thermal resistance of your heatsinks will likely be much higher, perhaps by as much as 20%. Without air flow, your custom heatsinks are dependent solely on what is called the “chimney effect.” To address this, your custom heatsinks must minimize friction between the metal surfaces of the heatsink and air while also providing enough surface area for enough heat transfer.

Heavily populated PCBs are more difficult to keep cool, and, as a result, custom heatsinks are typically needed to address the particular application. Significant airflow must be available across the PCB; if airflow is not properly managed, those heatsinks further away from the fan may not work as well as they need to, providing an opportunity for the components to overheat. Custom heatsinks for this type of application need to produce low pressure drop to maintain an appropriate airflow.

Though the variety of custom heatsinks is as great as it is because every application is slightly different from the next, hopefully these two scenarios will help you when considering your next application that requires custom heatsinks.

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BGA Heat Sinks and Folded Fin Heat Sinks

With the extraordinary variety of heat sinks available for various electronic applications. This article will define and briefly discuss two such examples: BGA heat sinks and folded fin heat sinks.

BGA heat sinks, or ball grid array heat sinks, have a printed circuit board (PCB) or laminated substrate. Electrical chip components are routed to an array of balls on the substrate bottom. These can range in size from a few millimeters to over 50 mm. Ball pitch is anywhere from 0.5 mm to 1.5 mm currently. The balls are typically on a rectangular grid though the grid can be square as well. The matrix populated by these balls may be either full or depopulated, terms which specify whether all available spots are filled or not.

Folded fin heat sinks, on the other hand, provide a high surface area in a small volume, which provides a high level of cooling. These heat sinks are comprised typically of one sheet of metal folded over and over in a particular pattern, creating those folds and large surface area. Folded fin heat sinks can be made in a number of different styles, from many different materials and with different fin densities. These can be used with or without a fan.

As mentioned earlier, heat sinks have an extraordinarily broad array of applications thanks to the broad range of electronics. BGA heat sinks and folded fin heat sinks are only two examples of the wide range of heat sinks available to address the problem of temperature management.

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