Different Challenges Addressed by Custom Heatsinks

Given the extraordinary prevalence of electronics in nearly every aspect of our daily lives these days, it’s no wonder the demand for custom heatsinks is so high. If you find yourself with a particularly difficult or unusual application for a custom heatsink, the following examples may be helpful to you when discussing your needs with a custom heatsink manufacturer.

If your electronic components are in need of cooling via natural convention rather than forced air cooling, this particular application is inherently more challenging. Without the air flow often provided by a fan, the thermal resistance of your heatsinks will likely be much higher, perhaps by as much as 20%. Without air flow, your custom heatsinks are dependent solely on what is called the “chimney effect.” To address this, your custom heatsinks must minimize friction between the metal surfaces of the heatsink and air while also providing enough surface area for enough heat transfer.

Heavily populated PCBs are more difficult to keep cool, and, as a result, custom heatsinks are typically needed to address the particular application. Significant airflow must be available across the PCB; if airflow is not properly managed, those heatsinks further away from the fan may not work as well as they need to, providing an opportunity for the components to overheat. Custom heatsinks for this type of application need to produce low pressure drop to maintain an appropriate airflow.

Though the variety of custom heatsinks is as great as it is because every application is slightly different from the next, hopefully these two scenarios will help you when considering your next application that requires custom heatsinks.

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BGA Heat Sinks and Folded Fin Heat Sinks

With the extraordinary variety of heat sinks available for various electronic applications. This article will define and briefly discuss two such examples: BGA heat sinks and folded fin heat sinks.

BGA heat sinks, or ball grid array heat sinks, have a printed circuit board (PCB) or laminated substrate. Electrical chip components are routed to an array of balls on the substrate bottom. These can range in size from a few millimeters to over 50 mm. Ball pitch is anywhere from 0.5 mm to 1.5 mm currently. The balls are typically on a rectangular grid though the grid can be square as well. The matrix populated by these balls may be either full or depopulated, terms which specify whether all available spots are filled or not.

Folded fin heat sinks, on the other hand, provide a high surface area in a small volume, which provides a high level of cooling. These heat sinks are comprised typically of one sheet of metal folded over and over in a particular pattern, creating those folds and large surface area. Folded fin heat sinks can be made in a number of different styles, from many different materials and with different fin densities. These can be used with or without a fan.

As mentioned earlier, heat sinks have an extraordinarily broad array of applications thanks to the broad range of electronics. BGA heat sinks and folded fin heat sinks are only two examples of the wide range of heat sinks available to address the problem of temperature management.

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