With the extraordinary variety of heat sinks available for various electronic applications. This article will define and briefly discuss two such examples: BGA heat sinks and folded fin heat sinks.
BGA heat sinks, or ball grid array heat sinks, have a printed circuit board (PCB) or laminated substrate. Electrical chip components are routed to an array of balls on the substrate bottom. These can range in size from a few millimeters to over 50 mm. Ball pitch is anywhere from 0.5 mm to 1.5 mm currently. The balls are typically on a rectangular grid though the grid can be square as well. The matrix populated by these balls may be either full or depopulated, terms which specify whether all available spots are filled or not.
Folded fin heat sinks, on the other hand, provide a high surface area in a small volume, which provides a high level of cooling. These heat sinks are comprised typically of one sheet of metal folded over and over in a particular pattern, creating those folds and large surface area. Folded fin heat sinks can be made in a number of different styles, from many different materials and with different fin densities. These can be used with or without a fan.
As mentioned earlier, heat sinks have an extraordinarily broad array of applications thanks to the broad range of electronics. BGA heat sinks and folded fin heat sinks are only two examples of the wide range of heat sinks available to address the problem of temperature management.
For further more about information : folded fin heat sinks Please visit to website
BGA heat sinks, or ball grid array heat sinks, have a printed circuit board (PCB) or laminated substrate. Electrical chip components are routed to an array of balls on the substrate bottom. These can range in size from a few millimeters to over 50 mm. Ball pitch is anywhere from 0.5 mm to 1.5 mm currently. The balls are typically on a rectangular grid though the grid can be square as well. The matrix populated by these balls may be either full or depopulated, terms which specify whether all available spots are filled or not.
Folded fin heat sinks, on the other hand, provide a high surface area in a small volume, which provides a high level of cooling. These heat sinks are comprised typically of one sheet of metal folded over and over in a particular pattern, creating those folds and large surface area. Folded fin heat sinks can be made in a number of different styles, from many different materials and with different fin densities. These can be used with or without a fan.
As mentioned earlier, heat sinks have an extraordinarily broad array of applications thanks to the broad range of electronics. BGA heat sinks and folded fin heat sinks are only two examples of the wide range of heat sinks available to address the problem of temperature management.
For further more about information : folded fin heat sinks Please visit to website
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