Engineers are faced with increased performance demands and miniaturization. Heat dissipation is an issue for both challenges. If heat dissipation were not necessary, all electronic devices would operate faster. Heat dissipation is necessary to keep devices from becoming unreliable, overheating, and failing. To produce reliable devices with long life and acceptable performance, heat dissipation must be introduced. Heat sinks are a method of removing heat.
Heatsinks are devices that dissipate heat from a heat generating component to a medium, usually air that is cooler. Heat sinks placed on hot components improve the transfer of heat by an increase of surface area that has direct air contact. The component’s operating temperature is lowered as heat is dissipated. Heat sinks maintain the temperature of a device below the maximum specified by the manufacturer.
To choose the appropriate heat sink necessary for thermal performance various parameters are considered and calculations performed. Extruded heatsinks allow two-dimensional profile formations that dissipate large heat loads. BGA heat sinks are simple extrusions. BGA heat sinks typically convert extruded fins into pins. The BGA heat sinks are crosscut to allow more diverse applications.
Bonded grid arrays are built to customer specifications. Very few power electronic applications are the same. A one-size-fits-all theory is not feasible. Bonded grid arrays dissipate as much as three times the amount of heat dissipated by the average extruded heatsink. Two styles of bonded grid arrays are available. They are single and folded fins. Fin density, thickness, and height are used in countless combinations to provide the desired performance.
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