Cooling Source has a standard line of BGA heat sinks. The company assists in the design of those who wish to ensure system design excellence. Cooling Source provides increasingly complex thermal solutions intended to meet engineering challenges that call for ever-increasing heat densities.
Categories of thermal solutions are natural and forced convection, liquid cooling, fluid phase change, and a range of thermal accessories. All Cooling Source BGA heat sinks support demanding applications.
Mounting Options
The mounting options are part of the design. The mounting options used by Cooling Source include push pins, spring clips, pre-applied interface tape, and solder anchoring. Pre-applied interface tape saves space by the elimination of mounting holes. The peel and stick assembly is convenient, quick, and clean.
Push pin attachment is a simple tool-free attachment. Spring clips are made of wire that resists breakage and is easy to install. The pressure they provide improves thermal contact.
Solder anchors provide the optimal ruggedness. The mounting requires minimal PC Board real estate. The lip design allows easy removal if rework is necessary.
Types of Bonded Grid Arrays
Customized BGA heat sinks have different interface materials, finishes, and heat sink size. Black anodize is the standard finish. Aluminum bonded grid arrays are high-efficiency heatsink cooling products, ideal for environments of linear air-flow. Copper heatsinks are perfect for omni-directional convection and airflow.
Two types of bonded grid arrays manufactured by Cooling Source are fansinks and round pin heatsinks. Fansinks are standard heatsinks with a small fan attached to the top. They are superb options for demo boards or test environments work because the provide about 200 linear feet per minute of airflow.
These BGA heat sinks provide significant cooling benefits compared to system level fans. The dedicated fan increases localized airflow. Thermal efficiency and performance are improved.
Fan heatsink designs meet specific application requirements by matching the correct thermal analysis and heatsink base style with the fan performance. The typically required power source from the board of fansinks is either five or 12 volt.
Common bonded grid arrays for chipsets and other cooling applications are round pin heatsinks. Cooling Source manufactures both copper and aluminum models. The most efficient models are forged to allow for high aspect ratio design.
Highly conductive material optimizes the heatsinks for demanding thermal environments. Round shape pin patterns are set in such a way that makes air flow efficiently through the heat sinks. Airflow can come from all directions with only a minimal performance impact.
Round pin heatsinks fan out heatsink fins within a given space environment. Heat is dissipated at higher ratios in low ventilation than in normal flat fin heatsink designs. Cooling Source carries standard heatsinks or will customize them as needed.
For further detail about bga heat sinks and bonded grid arrays to visit the website.
Categories of thermal solutions are natural and forced convection, liquid cooling, fluid phase change, and a range of thermal accessories. All Cooling Source BGA heat sinks support demanding applications.
Mounting Options
The mounting options are part of the design. The mounting options used by Cooling Source include push pins, spring clips, pre-applied interface tape, and solder anchoring. Pre-applied interface tape saves space by the elimination of mounting holes. The peel and stick assembly is convenient, quick, and clean.
Push pin attachment is a simple tool-free attachment. Spring clips are made of wire that resists breakage and is easy to install. The pressure they provide improves thermal contact.
Solder anchors provide the optimal ruggedness. The mounting requires minimal PC Board real estate. The lip design allows easy removal if rework is necessary.
Types of Bonded Grid Arrays
Customized BGA heat sinks have different interface materials, finishes, and heat sink size. Black anodize is the standard finish. Aluminum bonded grid arrays are high-efficiency heatsink cooling products, ideal for environments of linear air-flow. Copper heatsinks are perfect for omni-directional convection and airflow.
Two types of bonded grid arrays manufactured by Cooling Source are fansinks and round pin heatsinks. Fansinks are standard heatsinks with a small fan attached to the top. They are superb options for demo boards or test environments work because the provide about 200 linear feet per minute of airflow.
These BGA heat sinks provide significant cooling benefits compared to system level fans. The dedicated fan increases localized airflow. Thermal efficiency and performance are improved.
Fan heatsink designs meet specific application requirements by matching the correct thermal analysis and heatsink base style with the fan performance. The typically required power source from the board of fansinks is either five or 12 volt.
Common bonded grid arrays for chipsets and other cooling applications are round pin heatsinks. Cooling Source manufactures both copper and aluminum models. The most efficient models are forged to allow for high aspect ratio design.
Highly conductive material optimizes the heatsinks for demanding thermal environments. Round shape pin patterns are set in such a way that makes air flow efficiently through the heat sinks. Airflow can come from all directions with only a minimal performance impact.
Round pin heatsinks fan out heatsink fins within a given space environment. Heat is dissipated at higher ratios in low ventilation than in normal flat fin heatsink designs. Cooling Source carries standard heatsinks or will customize them as needed.
For further detail about bga heat sinks and bonded grid arrays to visit the website.
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