The bonded
grid arrays, used in manufacturing BGA heat sinks, have advantages in a variety
of applications. When designing a component, finding the appropriate device
needed for a cooling system that is effective, is a major step. BGA heat sinks
are available in ceramic and plastic.
The increased
heat dissipation rate is an important benefit provided by bonded grid arrays.
The advanced circuitry of the arrays allows quick thermal energy conveyance
without high levels of resistance that often occurs when the gull wing approach
is used for surface mounting. BGA heat sinks also have a great heat sink-pin
count capacity that cannot be achieved with gull wing lead. The ability to
auto-align, based on heat flow from the source, may be the most innovative
aspect of the bonded array grids. This increases the efficiency potential and
allows a greater thermal energy level to transfer through the heat sink.
A component
manufacturer needs to be aware of the BGA heat sinks drawbacks before making a
final decision. Standard methods of reworking and inspection cannot be used due
to the joint solder complexity. Visual inspection is not possible with the
bonded grid arrays. It is impossible, to individually adjust, solder joints. To
ensure BGA heat sinks technology’s reliability, using x-rays has been proposed
as a feasible inspection method.
Light-curable
adhesives are one of the newer technologies available for corner bonding. When
outside edges of BGAs are close to the edge of the array, the adhesive is very
important. The adhesives are applied post-flow. They cure in seconds. The flow
underneath is minimized as it is engineered to the edge of the component that is
wet.
For more info
about heat sinks and bonded grid arrays so please
visit my website.
No comments:
Post a Comment