Cooling Source is faced with the challenges of increasing performance demands and miniaturization of electronics. Heat dissipation is an issue for both challenges. If heat dissipation were not necessary, all electronic devices would run faster.
As it stands, without heat dissipation, devices fail, overheat, and are unreliable. Heat dissipation is needed to produce reliable devices with long life and acceptable performance. Tablets and smartphones get around heat dissipation because they use little power and heat is not an important issue.
Attaching a heat sink is a method of removing heat. Heatsinks enable heat to dissipate from the hot surface of a component that generates heat to a medium like air that is cooler and ambient. The least effective transfer in most situations is through the interface between the coolant air and the hot component.
Placing a heatsink on the hot surface increases the surface area and improves the heat transfer. The heat sink usually has fins that have direct air contact. More heat is dissipated, and the component operating temperature is lowered. Maintaining the device temperature below the manufacturer's recommended maximum is the main purpose served with heatsinks.
Choosing the Appropriate Heat Sink
In the selection of heatsinks, various parameters must be considered, and calculations performed that affect the heat sink performance as well as the performance of the overall system. Thermal performance is affected by the natural convection air flow or air flow forced using fans. The method of heat sink attachment such as thermal tape or past also affects thermal performance.
Types of Heat Sinks
The available variety of applications includes fabricated fin, board or surface mount, extruded, or BGA heat sinks. They come in a variety of fixing methods, performance levels, and sizes.
Board or surface mount heat sinks are mounted to both the device and the printed circuit board. They are usually constructed as an extrusion or stamping. They are designed for common packaging.
Extruded heatsinks have two-dimensional profiles that can dissipate large heat loads. They are cut, machined, or have added options. Cross-cutting produces omnidirectional pin fin heat sinks, rectangular in shape. Incorporated serrated fins improve the performance.
BGA heat sinks are given the name because they are mounted to bonded grid arrays. BGA heat sinks are simple extrusions. They are typically crosscut to convert extruded pins into pins that can be used in more diverse applications having bonded grid arrays.
Cooling Source has supplied heat sinks to the electronic industry since 2004. The company offers a comprehensive range of heat sinks. Cooling Source designs and manufactures heatsinks that supply many of the electronic industry's specified components. As proof of recognition as a dynamic company, Cooling Source has earned ISO9001 and ISO14001 certification.
For further detail about heatsink manufacturers and custom heatsinks to visit the website.
As it stands, without heat dissipation, devices fail, overheat, and are unreliable. Heat dissipation is needed to produce reliable devices with long life and acceptable performance. Tablets and smartphones get around heat dissipation because they use little power and heat is not an important issue.
Attaching a heat sink is a method of removing heat. Heatsinks enable heat to dissipate from the hot surface of a component that generates heat to a medium like air that is cooler and ambient. The least effective transfer in most situations is through the interface between the coolant air and the hot component.
Placing a heatsink on the hot surface increases the surface area and improves the heat transfer. The heat sink usually has fins that have direct air contact. More heat is dissipated, and the component operating temperature is lowered. Maintaining the device temperature below the manufacturer's recommended maximum is the main purpose served with heatsinks.
Choosing the Appropriate Heat Sink
In the selection of heatsinks, various parameters must be considered, and calculations performed that affect the heat sink performance as well as the performance of the overall system. Thermal performance is affected by the natural convection air flow or air flow forced using fans. The method of heat sink attachment such as thermal tape or past also affects thermal performance.
Types of Heat Sinks
The available variety of applications includes fabricated fin, board or surface mount, extruded, or BGA heat sinks. They come in a variety of fixing methods, performance levels, and sizes.
Board or surface mount heat sinks are mounted to both the device and the printed circuit board. They are usually constructed as an extrusion or stamping. They are designed for common packaging.
Extruded heatsinks have two-dimensional profiles that can dissipate large heat loads. They are cut, machined, or have added options. Cross-cutting produces omnidirectional pin fin heat sinks, rectangular in shape. Incorporated serrated fins improve the performance.
BGA heat sinks are given the name because they are mounted to bonded grid arrays. BGA heat sinks are simple extrusions. They are typically crosscut to convert extruded pins into pins that can be used in more diverse applications having bonded grid arrays.
Cooling Source has supplied heat sinks to the electronic industry since 2004. The company offers a comprehensive range of heat sinks. Cooling Source designs and manufactures heatsinks that supply many of the electronic industry's specified components. As proof of recognition as a dynamic company, Cooling Source has earned ISO9001 and ISO14001 certification.
For further detail about heatsink manufacturers and custom heatsinks to visit the website.
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