Exploration of ways to increase the density of devices and boards inside electronic enclosures while keeping internal temperature to a minimum continues.The designs, cabinet sizes, and enclosures of today vary substantially in heights and widths. Heights can be seven feet tall. They do have a common thread. The density and heat load inside the electronics are increasing. Thoughtful heat exchanger selection in relation to internal cabinet air flow patterns is required to properly cool the internal electronics
Natural convection works only when there are a few heat-generating components. If air circulation is improved by opening cabinet doors or if air is moved through the cabinet by high-powered fans, then debris, vermin, and dust contamination are less likely. Using cold plates or air-to-liquid heat exchangers are not viable alternatives. Unwelcome condensate, close in proximity to electronic components, may be introduced.
Alternatives, ideally suited for designs of modern enclosures exist. Heat transfer and air flow are optimized inside electronic enclosures by using two air flow paths. There is a horizontal and vertical air flow pattern. Either impingement cores or heat pipes are selected. Both technologies maintain a water tight and dust tight seal.
Heatpipes are the heat exchangers used for vertical air flow. Heat pipes use a unique capillary action that provide thermal conductivity that is extremely effective. The heatpipes can be planar or cylindrical. The surface inside the heat pipes is lined with capillary wicking material. Heatpipes are evacuated and back-filled with small amounts of working fluid such as methanol, acetone, or water. Vapors carry heat to the area where the vapor is condensed. Heat is released to the cooling media. Gravity pumps the condensed working fluid back to the evaporation side.
Heatpipes are passive heat transfer systems.They require no additional energy source or pump that will wear out.
For further detail about folded fin heat sinks and bonded fin heatsinks to visit the website.
Natural convection works only when there are a few heat-generating components. If air circulation is improved by opening cabinet doors or if air is moved through the cabinet by high-powered fans, then debris, vermin, and dust contamination are less likely. Using cold plates or air-to-liquid heat exchangers are not viable alternatives. Unwelcome condensate, close in proximity to electronic components, may be introduced.
Alternatives, ideally suited for designs of modern enclosures exist. Heat transfer and air flow are optimized inside electronic enclosures by using two air flow paths. There is a horizontal and vertical air flow pattern. Either impingement cores or heat pipes are selected. Both technologies maintain a water tight and dust tight seal.
Heatpipes are the heat exchangers used for vertical air flow. Heat pipes use a unique capillary action that provide thermal conductivity that is extremely effective. The heatpipes can be planar or cylindrical. The surface inside the heat pipes is lined with capillary wicking material. Heatpipes are evacuated and back-filled with small amounts of working fluid such as methanol, acetone, or water. Vapors carry heat to the area where the vapor is condensed. Heat is released to the cooling media. Gravity pumps the condensed working fluid back to the evaporation side.
Heatpipes are passive heat transfer systems.They require no additional energy source or pump that will wear out.
For further detail about folded fin heat sinks and bonded fin heatsinks to visit the website.
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