A base plate made of copper offers some advantages over aluminum such
as transferring heat faster. Because copper retains heat longer, some
are of the opinion that a copper base plate at the bottom of an aluminum
heatsink is the ideal design because aluminum will transfer heat away
from a central processing unit (CPU).
Forced convection is used
when heat is released to ambient air. Forced convection efficiency
depends on the temperature of the heatsink surface and air velocity. The
heatsink material is irrelevant. To say heat is released better in
aluminum rather than copper heatsinks is incorrect.
The
only thing that matters regarding cooling effect is the temperature of
the heatsink that is touched. While aluminum heatsinks are heating and
releasing heat in the air, copper heatsinks absorb the energy and stay
cooler. A cooler heatsink is best for the CPU.
When in use, the
CPU continuously produces heat. The capacity of any heatsink to absorb
energy is exhausted quickly. To dissipate heat steadily, both aluminum
and copper heatsinks have to reach the same pin temperature. The thermal
conductivity of the heatsink is all that matters. The temperature delta
of a copper heatsink is smaller, resulting in a cooler CPU.
Copper
round BGA heat sinks are highly efficient. They have an ideal
omnidirectional flow and convection environment. BGA heat sinks mount
with mounting clips or thermal tape to provide optimal cooling for
packages over various sizes and airflow.
The high-efficiency BGA
heat sinks install easily and have no complex assembly or special board
modifications. The heat sinks are made of oxygen-free copper for optimal
heat transfer. BGA heat sinks drastically increase gate count, chip
input and output, chip size, power consumption, and operating frequency.
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