Look to Cooling Source as One of the Heatsink Manufacturers That Provide Custom Heatsinks

Cooling Source is one of the heatsink manufacturers that make custom heatsinks. Below is a list of heatsinks the company designs. The heatsinks presented here are only a sample of custom heatsink manufacturers by Cooling Source

Custom aluminum heat sinks are used at nearly every level of electronic cooling because the cost of tooling is low. Cooling Source designs custom aluminum extrusions that are suitable for forced air and natural convection environments.

Die casting heat sinks is a method used by Cooling Source to design custom aluminum heat sinks. The manufacturing process forces liquid aluminum that is under high pressure into steel molds that can be reused. This solution is frequently used when a design calls for low thermal conductivity and high volume.

As one of Livermore, CA's leading heatsink manufacturers, Cooling Source makes custom bonded fin heat sinks. Applications for this type of heat sink include motor drives, variable speed motor controls, and uninterruptible power supplies.

Industries such as transportation, renewable energy, laser and optics, power electronics, medical equipment, and military and space look to heatsink manufacturers for cooling solutions. The custom cold plate options offered by Cooling Source include passive and active cooling solutions. The thermal performance needed dictates the method of manufacturing. For various applications, the methods used include copper brazed, aluminum-vacuumed brazed, machine-path water blocks, epoxy joint, and press-fit copper tubes.

A progressive stamping method is used in the creation of folded fin heat sinks. The fins are bonded to a base with metallurgical bonds such as welding, brazing, or epoxy that are thermally conductive. Folded fin heat sinks combine copper and aluminum to tailor heat sink performance for particular applications.

High conductivity copper is used when heat must be spread over large heat sink bases. When the spread of heat over a large surface is not necessary, low cost and weight aluminum is used by heatsink manufacturers. Common applications requiring folded fin heat sinks are automotive electronics, telecommunications, and power models that require high-density cooling.

Cooling Source makes skived fin heat sinks by literally shaving fins up from an extruded copper or aluminum base. A high fin-to-gap aspect ratio is created by slicing the fins then standing them up individually. Uniform height is maintained by cutting the fin tops. The increased surface area makes a drastic improvement in the thermal performance in environments of forced airflow.

Cooling systems is a one-stop shop for engineered, prototyped, and manufactured thermal solutions. The cutting-edge solutions are backed by knowledgeable engineers and first class customer service. Call them at 952-292-1293.

For further details about heatsink manufacturers and custom heatsinks please visit the website.

Disputing the Effectiveness of Aluminum Over Copper Heatsinks and Praising BGA Heat Sink

A base plate made of copper offers some advantages over aluminum such as transferring heat faster. Because copper retains heat longer, some are of the opinion that a copper base plate at the bottom of an aluminum heatsink is the ideal design because aluminum will transfer heat away from a central processing unit (CPU).

Forced convection is used when heat is released to ambient air. Forced convection efficiency depends on the temperature of the heatsink surface and air velocity. The heatsink material is irrelevant. To say heat is released better in aluminum rather than copper heatsinks is incorrect.

The only thing that matters regarding cooling effect is the temperature of the heatsink that is touched. While aluminum heatsinks are heating and releasing heat in the air, copper heatsinks absorb the energy and stay cooler. A cooler heatsink is best for the CPU.

When in use, the CPU continuously produces heat. The capacity of any heatsink to absorb energy is exhausted quickly. To dissipate heat steadily, both aluminum and copper heatsinks have to reach the same pin temperature. The thermal conductivity of the heatsink is all that matters. The temperature delta of a copper heatsink is smaller, resulting in a cooler CPU.

Copper round BGA heat sinks are highly efficient. They have an ideal omnidirectional flow and convection environment. BGA heat sinks mount with mounting clips or thermal tape to provide optimal cooling for packages over various sizes and airflow.

The high-efficiency BGA heat sinks install easily and have no complex assembly or special board modifications. The heat sinks are made of oxygen-free copper for optimal heat transfer. BGA heat sinks drastically increase gate count, chip input and output, chip size, power consumption, and operating frequency.

For further details about copper heatsinks and bga heat sinks please visit the website.

Copper Heat Pipes are Designed as Heatpipes for Military and Commercial Use

Military and commercial designers of heatpipes turn to copper heat pipes that use water as the working fluid for superior power density capacity. The choice is made without regard to gravity or orientation. The copper heat pipes are specifically designed for thermal challenges presented by gravity or high-heat loads.

Long life and reliability are critical. The copper heat pipes have a wick structure made of sintered copper powder that flawlessly operates against gravity and is tough enough to withstand temperatures from -55° C to 180° C and numerous freeze-thaw cycles.

With water as the working fluid, heat moves smoothly through the heatpipes from its source to the point where it is effectively managed through air or liquid dissipation or radiated to space. The heatpipes are integrated into a cold plate or heat sink to improve efficiency and conductivity.

The overall system performance is improved. The integration is accomplished through mechanical, solder, or epoxy interference. Copper heat pipes can last over 20 years. Copper heat pipes transfer heat more evenly than solid copper because they total thermal resistance is lower.

Both planar and cylindrical heatpipe variants have inner surfaces lined with capillary wicking material. Copper heat pipes are extremely effective in high-thermal conductivity. Solid copper conductivity ranges somewhere between 250 to 1500 Watts per meter Kelvin. Heatpipes range from 5000 to 200,000 W/m.K.

A small quantity of water fills the heatpipes. Vaporizing water absorbs the heat. Heat is transported by the vapor to the condenser region. There, the condensed vapor releases the heat to a cooling medium. The condensed water returns to the evaporator by gravity or the heatpipe wick structure. Capillary action is created.

A liquid-vapor phase change occurs in two-phase heat transfer. Passive capillary driven heatpipes are the most common of two-phase systems. Passive two-phase heat transfer devices have been designed, developed, and manufactured since 1970.

For further details about heatpipes and copper heat pipes please visit the website.

Cooling Source Designs and Manufactures Various Heat Sinks, Including BGA Heat Sinks for Bonded Grid Arrays

Cooling Source is faced with the challenges of increasing performance demands and miniaturization of electronics. Heat dissipation is an issue for both challenges. If heat dissipation were not necessary, all electronic devices would run faster.

As it stands, without heat dissipation, devices fail, overheat, and are unreliable. Heat dissipation is needed to produce reliable devices with long life and acceptable performance. Tablets and smartphones get around heat dissipation because they use little power and heat is not an important issue.

Attaching a heat sink is a method of removing heat. Heatsinks enable heat to dissipate from the hot surface of a component that generates heat to a medium like air that is cooler and ambient. The least effective transfer in most situations is through the interface between the coolant air and the hot component.

Placing a heatsink on the hot surface increases the surface area and improves the heat transfer. The heat sink usually has fins that have direct air contact. More heat is dissipated, and the component operating temperature is lowered. Maintaining the device temperature below the manufacturer's recommended maximum is the main purpose served with heatsinks.

Choosing the Appropriate Heat Sink 

In the selection of heatsinks, various parameters must be considered, and calculations performed that affect the heat sink performance as well as the performance of the overall system. Thermal performance is affected by the natural convection air flow or air flow forced using fans. The method of heat sink attachment such as thermal tape or past also affects thermal performance.

Types of Heat Sinks 

The available variety of applications includes fabricated fin, board or surface mount, extruded, or BGA heat sinks. They come in a variety of fixing methods, performance levels, and sizes.

Board or surface mount heat sinks are mounted to both the device and the printed circuit board. They are usually constructed as an extrusion or stamping. They are designed for common packaging.

Extruded heatsinks have two-dimensional profiles that can dissipate large heat loads. They are cut, machined, or have added options. Cross-cutting produces omnidirectional pin fin heat sinks, rectangular in shape. Incorporated serrated fins improve the performance.

BGA heat sinks are given the name because they are mounted to bonded grid arrays. BGA heat sinks are simple extrusions. They are typically crosscut to convert extruded pins into pins that can be used in more diverse applications having bonded grid arrays.

Cooling Source has supplied heat sinks to the electronic industry since 2004. The company offers a comprehensive range of heat sinks. Cooling Source designs and manufactures heatsinks that supply many of the electronic industry's specified components. As proof of recognition as a dynamic company, Cooling Source has earned ISO9001 and ISO14001 certification.

For further detail about heatsink manufacturers and custom heatsinks to visit the website.

Heat Pipes Used for Vertical Enclosure Air Flow Patterns

Exploration of ways to increase the density of devices and boards inside electronic enclosures while keeping internal temperature to a minimum continues.The designs, cabinet sizes, and enclosures of today vary substantially in heights and widths. Heights can be seven feet tall. They do have a common thread. The density and heat load inside the electronics are increasing. Thoughtful heat exchanger selection in relation to internal cabinet air flow patterns is required to properly cool the internal electronics

Natural convection works only when there are a few heat-generating components. If air circulation is improved by opening cabinet doors or if air is moved through the cabinet by high-powered fans, then debris, vermin, and dust contamination are less likely. Using cold plates or air-to-liquid heat exchangers are not viable alternatives. Unwelcome condensate, close in proximity to electronic components, may be introduced.

Alternatives, ideally suited for designs of modern enclosures exist. Heat transfer and air flow are optimized inside electronic enclosures by using two air flow paths. There is a horizontal and vertical air flow pattern. Either impingement cores or heat pipes are selected. Both technologies maintain a water tight and dust tight seal.

Heatpipes are the heat exchangers used for vertical air flow. Heat pipes use a unique capillary action that provide thermal conductivity that is extremely effective. The heatpipes can be planar or cylindrical. The surface inside the heat pipes is lined with capillary wicking material. Heatpipes are evacuated and back-filled with small amounts of working fluid such as methanol, acetone, or water. Vapors carry heat to the area where the vapor is condensed. Heat is released to the cooling media. Gravity pumps the condensed working fluid back to the evaporation side.

Heatpipes are passive heat transfer systems.They require no additional energy source or pump that will wear out.

For further detail about folded fin heat sinks and bonded fin heatsinks to visit the website.

Configuring Heat Sinks for LED Lighting

Light-emitting diodes, or LEDs, are a solid state lighting form. Typical LED lights are comprised of heat sinks, integrated optical lenses that shape the radiation pattern, and small pieces of semiconductors. LED heatsinks dissipate heat and keep semiconductor operating temperature low. 

LED lights have many advantages over incandescent sources of light. They include faster switching, smaller size, improved physical robustness, longer lifetime, and lower energy consumption. LED lights, when effectively used, provide ample light for rooms and street lighting. They do require more precise current and heat management and are more expensive than compact fluorescent and traditional incandescent lamp sources having comparable output. 

Operating temperature is directly linked to the life expectancy and performance of LED lights. Lower running temperatures mean better performance and a longer operating life. For increased durability and quality of lighting, the thermal aspect of the design is critical. LED lights are normally cooled with heat sinks that use natural convection. 

For better cooling, the use of honeycomb-configured LED heatsinks has been proposed. Honeycomb heat sinks weigh less but have more surface area. The number of cells that surround the heat source affects the cooling performance of honeycomb heat sinks. 

The number of cells is a crucial parameter concerning space and cost considerations. Large cell numbers mean more heat flux dissipation. The size restrictions of LED heatsinks limit the number of cells. Experimental testing and numerical simulation have provided a honeycomb heat sink design that effectively dissipates over 10 W of heat using natural convection. 

It also reduces the weight of the cooling system of LED lights. Studies have shown that increasing the number of cells along with other adjustments, improves the honeycomb heat sink performance. The honeycomb design developed for LED cooling is not new to the heatsink industry.

For further detail about copper heatsinks and heatsinks to visit the website.

Bonded Grid Arrays by Cooling Source Provide Quality BGA Heat Sinks Used for Thermal Design Solutions

Cooling Source has a standard line of BGA heat sinks. The company assists in the design of those who wish to ensure system design excellence. Cooling Source provides increasingly complex thermal solutions intended to meet engineering challenges that call for ever-increasing heat densities. 
Categories of thermal solutions are natural and forced convection, liquid cooling, fluid phase change, and a range of thermal accessories. All Cooling Source BGA heat sinks support demanding applications.
 
Mounting Options

The mounting options are part of the design. The mounting options used by Cooling Source include push pins, spring clips, pre-applied interface tape, and solder anchoring. Pre-applied interface tape saves space by the elimination of mounting holes. The peel and stick assembly is convenient, quick, and clean.

Push pin attachment is a simple tool-free attachment. Spring clips are made of wire that resists breakage and is easy to install. The pressure they provide improves thermal contact. 

Solder anchors provide the optimal ruggedness. The mounting requires minimal PC Board real estate. The lip design allows easy removal if rework is necessary. 

Types of Bonded Grid Arrays

Customized BGA heat sinks have different interface materials, finishes, and heat sink size. Black anodize is the standard finish. Aluminum bonded grid arrays are high-efficiency heatsink cooling products, ideal for environments of linear air-flow. Copper heatsinks are perfect for omni-directional convection and airflow. 

Two types of bonded grid arrays manufactured by Cooling Source are fansinks and round pin heatsinks. Fansinks are standard heatsinks with a small fan attached to the top. They are superb options for demo boards or test environments work because the provide about 200 linear feet per minute of airflow. 

These BGA heat sinks provide significant cooling benefits compared to system level fans. The dedicated fan increases localized airflow. Thermal efficiency and performance are improved. 

Fan heatsink designs meet specific application requirements by matching the correct thermal analysis and heatsink base style with the fan performance. The typically required power source from the board of fansinks is either five or 12 volt.

Common bonded grid arrays for chipsets and other cooling applications are round pin heatsinks. Cooling Source manufactures both copper and aluminum models. The most efficient models are forged to allow for high aspect ratio design. 

Highly conductive material optimizes the heatsinks for demanding thermal environments. Round shape pin patterns are set in such a way that makes air flow efficiently through the heat sinks. Airflow can come from all directions with only a minimal performance impact. 

Round pin heatsinks fan out heatsink fins within a given space environment. Heat is dissipated at higher ratios in low ventilation than in normal flat fin heatsink designs. Cooling Source carries standard heatsinks or will customize them as needed.  

For further detail about bga heat sinks and bonded grid arrays to visit the website.

Why Military and Commercial Designers Use Heat Pipes, Especially Copper Heat Pipes

Heat pipes are extremely effective in high thermal conductivity. Heat pipes transfer heat from its source to heat sinks over long distances through latent vaporized working fluid heat. Typically heat pipes have three sections. They are a sealed containment vessel or shell that is vacuum tight, a working fluid, and a capillary wick structure. They work together to transfer heat evenly and efficiently. 

Heat is absorbed by vaporizing the working fluid. Vapor transports the heat to condenser regions. As vapor condenses, it releases heat to cooling mediums. The heat pipes’ wicks structure or gravity returns the condensed working fluid to the evaporators. This process creates capillary action. Planar and cylindrical heat pipes have an inner capillary lined surface of wicking material. 

The working fluid saturates the inner surface of heat pipe shell. The wicks provide the structure needed for capillary action that returns liquid from the condensers to the evaporators. Because of the vacuum seal, the working fluid boils and takes up latent heat below its atmospheric pressure boiling point. Water boils at 0ᵒ C and transfers latent heat effectively at that temperature. 

Military and commercial designers use high-performance copper heat pipes for power density capacity regardless of orientation or gravity. They are specifically designed for applications having gravity present thermal challenges or high heat loads. Long life and reliability are critical. Copper heat pipes have sintered copper powder wick structures that operate precisely against gravity. The heat pipes are rugged enough to withstand temperatures that range from -55ᵒ C to 180ᵒ C and numerous freeze-thaw cycles. 

Water is the working fluid used in copper heat pipes. It moves heat from the source to where it can be managed through dissipation liquid, air, or radiated to space. The heat pipes are incorporated into custom thermal solutions designed by engineering teams. They are integrated into metallic cold plates or heat sinks to improve efficiency and conductivity. The heat pipes are incorporated into extended surfaces, cold plates, and heat sinks with mechanical interference, solder, or epoxy.

To know more about extruded aluminum heatsinks and heat sink extrusions visit to website.

How Improved Extruded Aluminum Heatsinks Are Used

Due to the malleability of an aluminum alloy, extruded aluminum heatsinks can be created in a variety of unique designs. Aluminum conducts and reflects heat well. Those qualities make it useful in applications of heat transfer and reflective heat shields. An aluminum alloy is low in cost and can be tempered in various ways. Through smelting, scraping, and refining the aluminum alloy can be pounded into sheets, fins, and foils.

Aluminum provides less thermal conductivity than other metals like copper. However, it is easier by far to make heat sink extrusions from aluminum that those other metals. Creating custom aluminum heat sink variation profiles is also considerably easier. Aluminum fin profiles can be attached easily to a copper base that conducts more thermal energy to the less expensive and lighter cooling fins made of an aluminum alloy.

Heat sink extrusions serve electronic, medical, military, automotive, electrical, and telecommunication industries. A liquid cooling solution that combines extrusions made of aluminum with friction stir welding makes air-cooled heat sinks higher quality and more thermally efficient that pressed or bonded fins.

Complex fin structures are created by forcing raw aluminum through extrusion dies. The complex fins allow more heat dissipation and increased surface area. Time and cost associated with machining a shape that is equivalent from block aluminum are eliminated.

To know more about copper heat pipes and heat pipes visit to website.

Heat Sinks Used in LED Lighting Designs

The correct LED heat sinks must be determined for new LED lighting designs. The approach of integral models and verification test discussed here give an insight into the functional integrity and operational reliability of design in meeting market expectations.

Each LED has its set of parameters. Ambient temperature is one of the parameters. Different lights require different temperatures. Mounted, open air spotlights need 30ᵒ C, recessed ceiling lights 50 to 55ᵒ C, and automotive lighting 45ᵒ C.

The parameters must be defined. The LED Chips on Board module manufacturers provide lifetime expectations under conditions that are ideal. They calculate 90 percent reliability for the maximum junction temperature.

In calculating the required LED heatsinks, it must be understood that each part of a design adds heat due to the material’s thermal resistance. The total design should be below the maximum junction temperature required.

A mathematical calculation is made to define the maximum thermal resistance heat sinks should have or the maximum rise in temperature LED heatsinks create when dissipating power. Thermal resistance is expressed as a Rth value. Some manufacturers give thermal resistance value for heat sinks that are independent of dissipation power and ambient temperature. The Rth value of LED heatsinks is not the same under all conditions.

After applying thermal pads and heat sinks, verify the design. Manufacturers include safety margins in their designs. A maximum of 97.4ᵒ C thermal measurement point should not be subjected to temperatures more than the range of 87 to 92ᵒ C.

All high power LEDs need to dissipate the heat produced to keep it below the maximum operating temperature. Overheating can cause a shortened life, a reduction in light output, an output color change, or complete LED failure.

To know more aboutheat sinks and led heatsinks visit to website.

All About Heat Sink Extrusions and Extruded Aluminum Heatsinks

Heat sink extrusions provide more natural convection solutions for high-powered systems and components. Complex fin structures are made by forcing raw aluminum through extrusion dies. The process of manufacturing aluminum heatsinks is somewhat like a Play-Doh factory. Pick the desired shape and squeeze Play-Doh through the shape.

The difference is extruded aluminum heatsinks exit the press opening at approximately 1000ᵒ F. In addition to the high temperature, the extrusion press pushes with a force in excess of 1500 tons. The pressure and temperature are controlled to obtain the profile required.

The complex fin profile allows greater heat dissipation by increasing the surface area while eliminating the time and cost associated with the machination of an equivalent shape made from block aluminum. The benefits of heat sink extrusion are:

• Greater efficiency than stamped heatsinks

• Cost less than assemblies that are fully machined

• Availability of many standard sizes and shapes

• Any application is easily customized

• A weight advantage over copper that is significant

• Tool and hardware mounting are eliminated by a clip system

When manufacturing extruded aluminum heatsinks, the press speed needed to maintain a steady extrusion pull-force, the weight, and the profile complexity are taken into consideration. Benefits of the system include:

• Reduced billet to billet dead cycle time

• Improved straightness

• Minimized scrap

• Improved yield throughout the process of manufacturing

The need for customized extruded aluminum heatsinks continues to grow. The growth reduces product cycle time and overall costs. Customized extruded aluminum heatsinks include:

• Shapes that require stretching and bending

• Detailed precision computerized numerical control used to make customized components that meet product application needs

• Aluminum fabrication from simple to complex precision machination

• Finishes such as heat treating, plating, painting, anodizing, or mechanical finishes

• Heat dissipation requirements.

To know more about heat sink extrusions and extruded aluminum heatsinks visit to website.

Characteristics of Bonded Grid Arrays and BGA Heat Sinks

Bonded grid arrays are heat sink assemblies that are highly efficient, cost effective, reliable thermal management solutions for density packed or high-power packaged applications. These characteristics hold true in demanding vibration and shock environments. Bonded grid arrays are used when simple extrusions are impractical. They lower thermal resistance and increase surface area. There are various configurations that can be assembled.

Any industry, employing high-powered electronic circuits can use bonded grid arrays. A partial list of industries includes factory automation, medical equipment, wireless and RF, military, broadcast, telecommunications, and renewable energy. When choosing bonded grid arrays consider the overall dimensions, specified thermal resistance, and the finish. Finishes include gold iridite, clear iridite, gold chromate, or unfinished.

Finding the device that is appropriate for a cooling system to be effective is important to the overall design of a component. BGA heat sinks are available in ceramic and plastic. A major benefit of BGA heat sinks is the increased heat dissipation rate.

The ball grid design is achieved by advance circuitry that allows quick thermal energy conveyance without the levels of resistance, prone to occur with the surface mounting approach of the gull wing. Gull wing leads cannot reach the heatsink pin count capacity of BGA heat sinks.

The most innovative BGA heat sinks aspect is the ability to self-align based on the heat flow from its source. This characteristic has the potential to allow greater thermal energy transfer levels and increase efficiency throughout the heatsink.

There are some drawbacks to consider before making a final decision. Because of the joint solder complexity, standard reworking and inspection methods cannot be achieved. Solder joints cannot be individually adjusted and basic visual inspection is not possible. A proposed solution to this problem is x-ray use to ensure reliable BGA heat sinks.

To know more about bonded grid arrays and bga heat sinks visit to website.

Designers Use Copper Heatpipes for Superior Performance

Heatpipes offer highly effective thermal conductivity and energy efficiency. Other positive characteristics are the low cost, light weight, and flexibility that provides many different shape and size options. Heatpipes offer a heat transfer system that is simple and reliable to operate. The system has no moving parts, transports heat over a long distance, and is a quiet, vibration-free operation.

Heatpipes are filled with small quantities of working fluid such as sodium, ammonia, methanol, nitrogen, acetone, or water. The working fluid is vaporized as heat is absorbed. The vapor transports the heat to a condenser region. The heat is released to a cooling medium by condensed vapor. Capillary action is created as the condensed working fluid returns to the evaporator by the heatpipe’s wick structure or gravity. Planar and cylindrical heatpipes have an inner surface that is lined with wicking material capillaries.

Military and commercial designers turn to copper heatpipes for superior power density, regardless of orientation or gravity. Copper heatpipes are designed specifically for applications where gravity or high heat loads present thermal challenges. Long life and reliability are critical. The copper heatpipe operates flawlessly against gravity and is rugged enough to withstand temperatures that range from 55ᵒ below zero to 180ᵒ C, and numerous freeze-thaw cycles.

Copper heatpipes use water as the working fluid. It smoothly moves heat from the source to an area where it can be managed effectively through liquid or air dissipation or radiation to space. These heatpipes are integrated into customized metallic cold plates or heat sinks. The integration improves the efficiency and conductivity. It allows the thermal designer to improve the performance of the overall system. The heatpipes can be integrated into extended surfaces, cold plates, and heat sinks through mechanical interference, solder, or epoxy.

For further details about heatpipes and copper heat pipes please visit the website.

Uses for LED and Copper Heatsinks

LEDs are a solid-state lighting form. Typical LED lights are made of small semiconductors; optical lenses, integrated to shape the radiation pattern; and LED heatsinks to keep a low operating temperature for the semiconductor and dissipate heat.

The life expectancy and performance of LED lights are directly linked to operating temperatures. The lower the operating temperature is, the longer the operating life and the better it performs. Thermal management is critical in a LED light design aspect. Thermal management increases the lighting quality and durability. LED lights are cooled by LED heatsinks using natural convection.

Honeycomb LED heatsinks have a LED chip located in the center of the heatsinks. Air passes through the hexagon-shaped holes and is carried away from the chip. The cooling performance of the heatsinks is affected by the rib-space ratio, the honeycomb aspect ratio, and the number of cells that surround the heat source.

Each new generation of devices having semiconductors has shrinking packages and a rise in the levels of power dissipation. Because of this trend, copper heatsinks are being used more often in a variety of applications.

A common technology available in copper heatsinks is the pin fin technology. Copper’s superior thermal properties satisfy challenging cooling requirements. When comparing aluminum and copper heatsinks  types of cooling scenarios and the value of copper, copper was recommended.

To understand the impact of copper heatsinks the thermal conductivity of aluminum versus copper must be considered. Applications demanding thermal stability are best served by copper heatsinks. Heatsinks having significant thermal mass are needed when power dissipation has a wide fluctuation, but a constant temperature is needed. In such a situation, copper with its 40 percent higher thermal mass is a better choice than aluminum.

For further details about heatpipes and copper heat pipes please visit the website.

The Difference between Bonded Grid Arrays and BGA Heat Sinks

Engineers are faced with increased performance demands and miniaturization. Heat dissipation is an issue for both challenges. If heat dissipation were not necessary, all electronic devices would operate faster. Heat dissipation is necessary to keep devices from becoming unreliable, overheating, and failing. To produce reliable devices with long life and acceptable performance, heat dissipation must be introduced. Heat sinks are a method of removing heat.

Heatsinks are devices that dissipate heat from a heat generating component to a medium, usually air that is cooler. Heat sinks placed on hot components improve the transfer of heat by an increase of surface area that has direct air contact. The component’s operating temperature is lowered as heat is dissipated. Heat sinks maintain the temperature of a device below the maximum specified by the manufacturer. 

To choose the appropriate heat sink necessary for thermal performance various parameters are considered and calculations performed. Extruded heatsinks allow two-dimensional profile formations that dissipate large heat loads. BGA heat sinks are simple extrusions. BGA heat sinks typically convert extruded fins into pins. The BGA heat sinks are crosscut to allow more diverse applications.

Bonded grid arrays are built to customer specifications. Very few power electronic applications are the same. A one-size-fits-all theory is not feasible. Bonded grid arrays dissipate as much as three times the amount of heat dissipated by the average extruded heatsink. Two styles of bonded grid arrays are available. They are single and folded fins. Fin density, thickness, and height are used in countless combinations to provide the desired performance.

For further details about bonded grid arrays and bga heat sinks please visit the website.

Benefits of Extruded Aluminum Heatsinks

Extruded aluminum heatsinks provide a range of convection solutions for high power systems and components. Complex structures force raw aluminum through a die. The complex fin profiles allow heat dissipation through a greater surface area while eliminating the time and cost associated with using block aluminum machining to make an equivalent shape.

There are many benefits to using extruded aluminum heatsinks. Stamped heat sinks are not as efficient as extruded aluminum heatsinks. Heat sink extrusions cost less than fully machined assemblies. Many standard sizes and shapes are available. Heat sink extrusions are easy to customize for any application. A significant weight advantage exists compared to copper. Mounting tools and hardware are eliminated.

Heat sink extrusions combined with friction stir welding technology provide high-performing, cost-effective solutions. Heat sinks that are cooled by friction stir welding provide a product of higher quality and more efficient than pressed or bonded fin products.

Extruded heat sinks are the most common type used for thermal management. Extruded materials start as 30 to 40 sticks that are very soft. The material is grabbed and stretched to produce straight sticks. After being stretched, the material is either over or air aged depending on the hardness required. Final fabrication such as pockets and holes are cut after the aging process.

A finish is usually applied to enhance the thermal performance. A chromate finish provides somewhat of a corrosion protector. It is also used as a primer before a powder coating, or final paint is applied. Extruded shapes are unique to the needed requirements, yet are the most cost-effective solution for cooling. Each shape is designed to achieve the optimal structural and thermal performance. 

 For further details about extruded aluminum heatsinks and heat sink extrusions please visit the website.

Heat Pipes Protect Against Thermal Failure in Embedded Electronics

Embedded computing systems are important in the military of today. A given mission uses the critical functionality for data processing and significant computing power. The systems’ electronics are extremely expensive. Often the thermal management solution is overlooked. Electronics intensify thermal challenges. Trends lean toward packaging with less volume and weight and higher heat fluxes.

Multiple electronics cards that are inserted into a chassis or rack are embedded into computing systems. They are sealed to assure no small particles or liquid comes in contact with the electronics. Mechanical retainer clamps hold the cards in the chassis. Heat is conducted to the edge of the card, through the clamp, along the chassis until it is rejected through pumped liquid or convection.

The most economical and easiest approach to improving thermal performance is the reduction of thermal gradients caused by conduction. Embedded heat pipes are the best method to achieve the reduction. Heatpipes offer passive, efficient heat transfer.

Utilizing heat pipes is a two-phase process of transferring heat. The vaporization of a fluid’s latent heat is used to an advantage. The closed loop system is made up of a small amount of liquid, an internal wick structure, and a sealed envelope or tube. During the process, there is no air in the tubes, which allows heatpipes to maintain vapor and liquid phases over a wide range of temperatures. 

Waste heat enters the heat pipes near the evaporator, which is a heat generating component. As the heat vaporizes the liquids, an internal pressure gradient is formed. Vapor is forced to the condenser, by the internal pressure gradient. Here the fluid loses its heat, condenses, and is returned to the evaporator through the wick structure’s capillary force.

Most common heatpipes use copper envelopes for applications involving terrestrial electronic cooling. The heat pipes also have a copper wick and the working fluid used, is water. The system provides the ultimate in power capacity within the temperature range of typical electronic operation.

For further details about heatpipes and heat pipes please visit the website.

Selecting Suitable Heat Sinks

Computer designers keep products cool by following some fundamental equations for designing heat sinks that use forced air or natural convection cooling. High current diodes, numerous power-supply regulator assemblies, and power modules and transistors generate more heat than the mass can dissipate safely. To effectively increase the surface area and mass of heat-dissipating junctions, suitable heatsinks must be securely fastened to power devices.

Heat sinks are available in a variety of surface finishes, colors, sizes, and shapes for general and specific semiconductor applications. The amount of heat generated by a power module or semiconductor depends on the applied signal shape, signal amplitude, bias level, and operation mode. The devices need heatsinks to dissipate the generated internal power.

High current diodes and silicon power transistors need heat sinks that allow maximum junction temperature. Heat-generating devices that are not connected to heatsinks that provide greater surface area and mass will barely approach the voltage and junction current specifications, before exceeding the maximum temperature of the collector junction. That is why device specification sheets list characteristics with devices mounted on heat sinks of considerable size, usually referred to as ‘infinite’ heatsinks.

The surrounding air temperature of the heat-generating devices must be considerably less than the allowable temperature of the junction for devices to cool. Heat sinks attempt to reduce the temperature of the junction to that of surrounding mediums. To be thermally perfect the heatsinks would allow the transistor junction temperature to reach the temperature of the lower ambient. 

Reaching that temperature is impossible in practice. The connections are thermally imperfect and consequently, produce temperature differentials. The variable between ambient and collector junctions are kept to a minimum with heat sinks.

For further details about heatsinks and heat sinks please visit the website.

Bonded Grid Arrays, BGA Heat Sinks, Solve Configuration Problems

The level of heat in today’s power electronics is ever increasing. Efforts to expand the number of fins for cooling have become necessary. Densely compact components are making the cooling system packages smaller. The increased fin count cannot add to the volume of the systems.

Heat sinks cool as heat input from a component, or mounting surface is transferred to the cooler ambient air. More heat can be removed with more heat surface area. A flat plate would increase airflow needed to dissipate heat, but the surface area needed, would be too large to fit in the available space. Adding fins to the base plate increases the amount of surface coming in contact with the air. The amount of cooling is increased without increasing the footprint occupied by the heat sink. The application is used for both natural convection and forced air.

The fins can be part of the aluminum base. As an alternative, bonded grid arrays are used. Bonded grid arrays allow a higher fin count. Taller fins than those of conventional extrusions are used.

Extruded heat seats are inexpensive and easy to manufacture. Aluminum extrusion lengths are produced, cut, and machined to the size requirement. The shaping die and extrusion tooling used in the process of manufacturing places limits on the finished product. The heat sink’s flexibility is limited by the maximum base-to-fin thickness, the minimum thickness-to-height, and the height-to-gap ratio aspect when heated aluminum is forced through the die of steel and creates the required two-dimensional shape.

Bonded grid arrays reduce the limits of fin ratios by separating base and fin extrusions. BGA heat sinks allow nearly limitless fan heights and increased cooling due to decreased center-to-center spacing. Before the recent use of BGA heat sinks, the most effective way to attach fins was the use of epoxy filled joints. The thin bond line and high conductivity of the epoxy result in a bit of thermal resistance. BGA heat sinks increase the achievable fin height-to-gap ratio to as much as 40:1

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Advantages of Extruded Aluminum Heatsinks

Using extruded aluminum heatsinks provides a greater range of convection solutions needed for high power systems and components. By forcing raw aluminum through extrusion dies, complex fin profiles have increased surface area that allows greater heat dissipation. The time and cost of an equivalent shape using block aluminum is eliminated.

The benefits of extruded aluminum heatsinks include:

•    More efficiency

•    Lower costs

•    Availability of many sizes and shapes

•    Easy customization for any application

•    Weight advantage over copper

•    Mounting tools and hardware are eliminated

The latest technology is used to test and prototype extruded aluminum heatsinks to provide the most effective thermal products. Extruded aluminum heat sinks are designed for forced air cooling and natural convection. Plating options include chromatic and anodization. Multiple extruded aluminum heatsinks can be produced. Shapes include tube, solid, semi-hollow, rod, bar, profile, and hollow. Customers can also specify unique custom shapes.

The compact designs of today require one-piece aluminum heat sink extrusions. That design prevents premature failure and limits temperature rise. Heat sink extrusions satisfy a wide range of needs for semiconductor cooling. Heat sink extrusions are customized to perform optimally for any application.

Aluminum heat sink extrusions have eliminated labor-intensive, bonded-fin heat sinks. The overall size has been reduced. The original heat sink prototype was overdesigned. A thermal analysis that used maximum operating conditions, environmental constraints and a power component layout allowed a high-ration extrusion that met the thermal requirements to be developed. 

That is the process used to find solutions to heat sink extrusion challenges. Often,  heat sink prototypes that are too expensive, too heavy, or too large can be replaced by extruded aluminum heatsinks.

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When to Use Copper and LED Heatsinks

Understanding the physics behind functionality of heatsinks helps determine the engineering and design elements that govern the quality of a heatsink. Materials affect the efficiency of heatsinks. Air has low thermal conductivity. That explains why air cannot be blown past a central processing unit (CPU) for performance-grade cooling achievement. 

Copper makes an excellent heatsink material in many situations. It has the best potential for conductive heat transfer. Copper allows heat to transfer quickly. For that reason, applications that require quick heat transfer utilize the metal. An example of such an application is found in copper heatsinks.

Searching for copper heatsinks, that utilize copper fins and copper heat pipe structures is commendable. Copper fins are not a necessity, but copper heat pipes are highly recommended. Some manufacturers use aesthetic materials such as nickel plating to cover up copper. Appearance does not always define the material used in copper heatsinks.

LEDs are used in many applications such as automotive, industrial, and household lighting. LED applications present thermal challenges because of cost restrictions, complex environment, dissipation, and small size. The small size allows LEDs to be clustered together to produce more or brighter light. Transferring heat from LEDs into heatsinks is extremely important.

LED heatsinks are manufactured to be compatible with specific LED components. The material used in LED heatsinks is light weight aluminum. Radial-fin geometry optimizes natural convection. LED heatsinks are easily mounted with standard hardware. The level of performance and size are matched to the specific requirements of the purchaser.

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